Description & Requirements
About the Role
The Lead Principal Engineer, Connectivity Innovation, plays a pivotal role in the Connectivity Strategic Business Unit. The business unit develops 5G TCUs and V2X Software as a Solution (SaaS) products, among other technologies, for various OEMs across the globe. You may interact with customers around the globe, HARMAN's global engineering as well as SAMSUNG innovation teams, technology partners and other stakeholders to develop connectivity solutions for both the automotive and adjacent markets. The role will require technical expertise in a variety of areas including Telematics Control Units, V2X (direct and network), and 3GPP based telecommunication solutions, short-range RF wireless technologies, cloud technologies, embedded solutions and strong experience in various aspects of automotive product development while also demonstrating solid understanding of the overall connectivity ecosystem and use cases that drive the business. The role encompasses a remit to drive performance, clarity, and efficiency through people, processes, and platforms.
Your Team
As an individual contributor, you will be expected to lead and work with the immediate innovation members as well as matrix-functional team members drawn from all relevant functions within the business. Also, as a Sr. Principal Engineer, we seek your ability to provide technical leadership and mentoring to less experienced engineers and interns.
What You Will Do
Incubate new innovative solutions, products and use-cases, to enhance our business unit product roadmap
Drive product system level architecture value-add enhancement to existing products, towards next generation products, or transformation product and applications including SaaS based solutions
Interface with standards members to ensure synchronization with latest standards roadmaps and/or to help in influencing our consortia engagement work-items
Integrate functional safety and cybersecurity standards, and compliance mechanisms (e.g., ISO26262, ISO/SAE 21434, GDPR) into the software design for secure data transmission and storage.
Prototyping, Testing & PoCs: Lead hands-on embedded system architecture definition and development of proof of concepts (PoC's) and validation setups to ensure system performance, data flow, and functional integrity.
Technical Leadership & Roadmap: Collaborate with product and engineering teams to build and refine the software development roadmap, aligning with hardware requirements, platform specifications, and market needs.
Provide technical mentorship and guidance on system architecture and troubleshooting, influencing engineering best practices.
Customer Engagement & Technical Strategy: Engage directly with customers to understand their requirements, define system specifications, and translate them into architectural designs.
Technology Scouting & Innovation: Continuously explore emerging technologies relevant to connectivity, vehicle telematics, V2X, edge computing, cybersecurity, and system design and implementation of AI-based solutions.
Contribute to the creation of patents or technical publications, and technical documentation
Active participation in the vote and definition of product, supplier, and customer requirements in the context of burden/specification process
What You Need
Bachelor's or Master's degree, preferably in engineering, science or related field.
15 or more years of experience in HW development for automotive embedded systems
Solid foundation in embedded connectivity system architecture with and deep understanding of HW and SW requirements
At least 7+ years of experience in hands-on technology innovation in automotive or connectivity industries
In-depth-knowledge in the following technologies: 5G Cellular, Satellite Communications, GNSS, Short-range wireless RF Technology, V2X, MEC/Cloud Communication/Compute
In-depth understanding of functional safety, Cybersecurity requirements.
Ability to communicate advanced and complex concepts and ideas persuasively and concisely at all levels
Critical thinking, analytical and prioritization skills
What is Nice to Have
Ph.D. in engineering, science or related field
Automotive industry, or adjacent market, product development process
Experience in ADAS and/or IVI embedded systems
Experience with AI-based applications
What Makes You Eligible
Be willing to travel up to 10% - domestic and international travel
Be willing to work in an office environment - Location: Novi, Michigan (hybrid)
Successfully complete a background investigation and drug screen as a condition of employment
What We Offer
Access to employee discounts on world-class Harman and Samsung products (JBL, HARMAN Kardon, AKG, etc.)
Extensive training opportunities through our own HARMAN University
Competitive wellness benefits
Tuition Reimbursement
Access to HARMAN Campus Fitness Center and Cafeteria
An inclusive and diverse work environment that fosters and encourages professional and personal development
#Hybrid
#LI-MM1
Pay Transparency
$ 120,750 - $ 177,100
Dependent on the position offered, other forms of compensation are also available, such as bonuses or commission.
Pay is based on a wide range of factors, including, without limitation, skill set, experience, training, location, and business need. While the above range is a reasonable estimate of the wage range for this position, please note the disclosed range estimate has not been adjusted for the applicable geographical differential associated with the location where the position may be filled.
Benefits
HARMAN is interested in... For full info follow application link.
HARMAN is an Equal Opportunity /Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or Protected Veterans status.
